PCB Fabrication & PCBA Assembly Capabilities
| Item | Specifications / Capabilities |
|---|---|
| Assembly Types | SMT (Surface Mount Technology), THT/DIP (Through-Hole Technology), Mixed Technology (SMT + Thru-Hole) |
| Service Scope | Full Turnkey (Component Sourcing + PCB + Assembly), Partial Turnkey, Consigned / Kitted |
| Production Volume | Quick-turn Prototyping, Low-to-Medium Volume Trial, Mass Production |
| Item | Specifications / Capabilities |
|---|---|
| Component Types | Chips, capacitors, resistors, connectors, and other various SMT components |
| Max. PCB Board Size | 510mm × 460mm |
| Min. PCB Board Size | 50mm × 50mm |
| PCB Board Thickness | 0.5 mm - 3.0 mm |
| Min. Component Size | 0201 metric (0.2 × 0.1 mm) / 008004 imperial — machine capability; mass production subject to DFM review. |
| Fine Pitch Components | BGA / SOP / QFP / QFN: pitch ≥ 0.3 mm. Micro-BGA and CSP: project review required. |
| BGA Ball Pitch & Diameter | Ball pitch ≥ 0.3 mm; Min. BGA ball diameter: 0.15 mm |
| Placement Accuracy | Placement accuracy: ±0.035 mm. Process capability: Cpk ≥1.0 under defined production conditions. |
| Reflow Capability | 9 heating zones + 3 cooling zones; double-sided reflow; lead-free profile control. |
| Stencil | Laser-cut stainless-steel stencils; nano-coated stencils for fine-pitch printing; step stencils for mixed paste-height designs. |
| Item | Specifications / Capabilities |
|---|---|
| Component Types | Various DIP ICs, connectors, electrolytic capacitors, transformers, inductors, switches, etc. |
| Soldering Options | Lead-Free Assembly for RoHS-Compliant Projects; SnPb Assembly Available Where Applicable. |
| Soldering Methods | Wave Soldering , Hand Soldering , Selective Wave Soldering |
| Max. Wave Width | 350mm |
| Component Insertion | Radial, Axial, Connectors, Headers, Heavy-duty Components |
| BGA Rework | In-house BGA rework covers removal, reballing and re-soldering, followed by documented post-rework inspection. X-Ray verification is applied to the defined hidden-joint locations to confirm the specified rework condition. |
| Item | Specifications / Capabilities |
|---|---|
| 3D Solder Paste Inspection (SPI) | Inline 3D SPI; 100% inspection coverage for approved projects. |
| AOI Inspection | AOI inspection for SMT assemblies; coverage defined by the approved inspection plan. |
| X-Ray Inspection | X-Ray inspection for BGA/QFN hidden joints; voiding analysis available by project requirement. |
| FCT (Functional Test) | Functional testing based on customer-provided or mutually approved fixtures, firmware, and test procedures. |
| ICT (In-Circuit Test) | Flying probe test or bed-of-nails testing upon request. |
| First Article Inspection | First-article verification supported by automated first-article inspection equipment and approved assembly data. |
| Acceptance Standard | Default: IPC-A-610 Class 2. Class 3: by project agreement. |
| ESD & Traceability | Full-line ESD protection across all assembly processes; batch-level traceability from incoming materials to finished assemblies. |
| Item | Specifications / Capabilities |
|---|---|
| Conformal Coating | Automated conformal coating for moisture, dust, and corrosion protection. |
| IC Programming | Supports firmware burning for Tray, Tape, and Tube packaged ICs. |
| Box Build Assembly | Customer-defined electromechanical integration may include enclosure assembly, cable/harness connection, agreed functional integration and final packaging. |
| Component Sourcing | Customer-approved, authorized, or qualified sourcing channels; traceability documents available by project requirement. |
| PCBA Cleaning | Dry-ice cleaning available as a solvent-free dry-cleaning option, subject to material compatibility and project requirements. |
The published parameters provide a reference to SUNHOPE’s current PCB fabrication and PCBA assembly capabilities. Every project is reviewed individually, covering the relevant DFM considerations, material selection, stack-up, component compatibility, process feasibility and acceptance requirements for the scope selected. Before production release, our engineers provide practical, actionable feedback to strengthen manufacturability, support stable yield and define a controlled production route.
We recommend sharing the design data applicable to your selected scope—such as Gerber files, fabrication drawings, BOM and pick-and-place data—as early as practical. Early review helps identify manufacturability risks before tooling or line release, reduce avoidable design iterations and support a smoother transition from prototype or trial build into the agreed production stage.
The specifications published on this page are reviewed and updated on a regular basis to reflect our latest process capabilities. For requirements that exceed the listed parameters, please contact our engineering team directly for a dedicated feasibility assessment.