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PCB Assembly Services forSMT THT and Mixed Technology
A reliable assembly is not created at the end of the line. It begins when the PCB data, BOM, component package, process route and test expectations are made consistent. SUNHOPE provides PCB assembly services for SMT, through-hole and mixed-technology products, with full turnkey, partial turnkey and consigned material models. From prototype builds to repeat production, we align the released data, material decisions, line setup and verification plan before the assembly is released.
Production Scope：Prototype Builds｜Low-Volume Runs｜Repeat Production
SMT
THT / DIP
Mixed Technology
Full Turnkey
Partial Turnkey
Consigned/Kitted
Choose the Right Assembly Route
Choose by Component Mix Not by Habit
The right route follows the actual component set and the work the assembly must perform. Board layout, package density, mechanical load, thermal exposure, inspection access and repair strategy all influence the decision. Many practical products combine SMT and through-hole processes on the same assembly.
Final feasibility depends on the complete PCB construction, component package and availability, paste and soldering requirements, clearances, thermal sensitivity, test access and acceptance criteria.
The commercial model should state who purchases, supplies and approves every material group. SUNHOPE supports three service models so purchasing responsibility can match the customer's supply strategy. Manufacturer part numbers, approved sources, alternatives and traceability expectations are aligned before release; substitutions are not introduced without the required customer approval.
SUNHOPE coordinates component sourcing, PCB manufacturing and assembly within the approved scope.
ComponentsSUNHOPE Coordinates
PCBSUNHOPE Manufactures
AssemblySUNHOPE Assembles
Useful When
Teams seeking one coordinated supply and manufacturing route
Shared Material Control
Partial Turnkey
Responsibility is divided by the agreed material list; SUNHOPE sources selected items and the customer supplies the remainder
ComponentsSUNHOPE Coordinates
PCBSUNHOPE Manufactures
AssemblySUNHOPE Assembles
Useful When
Programs with strategic, allocated or customer-controlled components
Customer-Owned Material
Consigned/Kitted
The customer supplies the defined component kit and SUNHOPE performs the agreed PCB and assembly work
ComponentsSUNHOPE Coordinates
PCBSUNHOPE Manufactures
AssemblySUNHOPE Assembles
Useful When
Teams that retain purchasing control or already hold the materials
Assembly Scope and Capability Snapshot
Useful Numbers with TheirConditions
The values below provide an initial project-fit check. They describe SUNHOPE’s current published baseline and do not replace review of the complete PCB, BOM, assembly data and test requirements. Features near a limit, or several demanding features combined in one build, are reviewed before quotation and production release.
Single- or double-sided routes are selected by the approved build
SMT PCB Size
50 × 50 mm to 510 × 460 mm
Panel format, edge clearance and tooling are reviewed with the assembly data
Board Thickness
0.5–3.0 mm
Applies to the current published PCBA baseline
Minimum Component
0201 metric / 008004 imperial
Machine capability; mass-production application is subject to DFM review
Fine-Pitch Packages
BGA/SOP/QFP/QFN pitch ≥0.3 mm
Micro-BGA and CSP require project review
Placement Performance
Accuracy ±0.035 mm; Cpk ≥1.0
Under defined production conditions
THT Soldering
Wave selective wave hand soldering
Maximum published wave width 350 mm
Reflow Platform
9 heating zones + 3 cooling zones
Double-sided lead-free profile supported
Acceptance Baseline
IPC-A-610 Class 2 by default
Class 3 applies only by project agreement
Data and Engineering Readiness
Align the Digital Product Before the Physical Build
PCB assembly begins with a digital product definition: the board revision, BOM, placement data, drawings, polarity, approved alternatives and test instructions. SUNHOPE reviews the applicable package before line release so the factory is not forced to resolve design intent through guesswork.
Equipment performs operations; the manufacturing route connects decisions. SUNHOPE carries the confirmed revision and project requirements through material preparation, line setup, assembly, verification and release. The exact steps change with SMT, THT or mixed technology, but the control logic remains connected.
01Data BOM and DFA Review
Confirm the released package, component-to-footprint consistency, polarity, assembly route, tooling and test readiness. Return unresolved questions before release.
02Material PCB and Tooling Preparation
Prepare sourced or consigned components, verify the applicable PCB, control moisture-sensitive material, and ready stencils, pallets, programs and fixtures for the approved build.
03Line Setup and First Article
Load the confirmed programs and process settings, verify the first article against the released assembly data, and approve the line condition before continued production.
04SMT THT or Mixed Assembly
Apply solder paste and inspect it where applicable, place and reflow SMT components, then complete the defined through-hole insertion and wave, selective or hand-soldering route.
05Inspection Test and Release
Use the agreed inspection and test plan, resolve exceptions within the defined authority, confirm identity and batch linkage, then clean where applicable and package the finished assemblies.
Quality Evidence and Test Alignment
Use Each Method to Answer a DefinedQuestion
Inspection is strongest when the question is clear: Was the paste deposited as planned? Are visible components present and oriented correctly? Are hidden joints acceptable? Does the finished assembly perform the agreed function? SUNHOPE combines process inspection and product testing according to the approved plan rather than treating one machine as a universal answer.
Solder-paste processInline 3D SPI with 100 percent coverage for approved projectsChecks paste geometry before placement and reflow
Visible SMT assemblyAOI according to the approved inspection planChecks applicable presence, position, polarity and visible solder features
Hidden jointsX-ray for BGA and QFN; voiding evaluation by projectProvides evidence where optical inspection cannot see the joint
First-build alignmentFirst-article inspection using automated equipment and approved assembly dataConfirms the line setup against the released product definition
Electrical and functional resultFCT using customer-provided or mutually approved fixtures, firmware and procedures; ICT by flying probe or bed-of-nails on requestConnects test coverage with an agreed method, limit and responsibility
Acceptance and traceabilityIPC-A-610 Class 2 by default; Class 3 by project agreement; ESD controls and batch traceabilityMakes release criteria and production linkage explicit
Why SUNHOPE for PCB Assembly
Keep the Board MaterialProcess and Evidence Connected
SUNHOPE's advantage is not a longer list of isolated operations. It is the ability to keep the product definition connected as the project moves from bare board and material decisions into assembly and verification.
SUNHOPE's 1–8 layer rigid PCB manufacturing can continue into SMT, THT or mixed assembly within one coordinated project route, reducing avoidable handoff gaps.
Three assembly routes
Surface-mount, through-hole and mixed-technology products are planned around the actual component set instead of forcing every design into one process.
Controlled material decisions
Full turnkey, partial turnkey and consigned models make purchasing responsibility visible, while alternatives follow the required approval path.
Learning that carries forward
First-article findings, approved process settings and controlled revisions can support the transition from quick-turn prototypes and trial builds into repeat production.
Evidence tied to release
SPI, AOI, X-ray, first-article inspection and functional or in-circuit testing are selected to answer the questions defined for the project.
Project Fit Industries and Added Scope
Build Around the Product's Real Operating Context
The same component can create different assembly concerns in different products. Density, power, vibration, thermal load, cleaning, coating, programming, traceability and service-life expectations should be tied to the actual application instead of inferred from an industry label alone.
Industry references describe common manufacturing considerations; they do not by themselves establish a product certification, regulatory approval or guaranteed suitability. The actual design, application and agreed requirements govern the project.
Value-Added Scope Available by Project
Extend the Build without
Breaking the Definition
Each added operation is reviewed within the
agreed project scope
Automated Conformal Coating
IC programming for Tray
Tape or Tube Formats
Box-build Electromechanical Integration
Cables or Harnesses
Agreed Functional Checks
Final packaging
Compatible dry-ice cleaning
Select 01–05 to review each PCBA project input
The build passport
One Controlled Package for the Line
Send the information available today, identify what is still open and state what must not change. A complete package shortens clarification, but an early engineering question is also welcome when the route, sourcing model or test responsibility has not yet been finalized.
Recommended PCBA RFQ Information
Gerber files, fabrication drawing and the released PCB revision
BOM with manufacturer part numbers, quantities, approved alternatives and do-not-substitute items
CPL or pick-and-place data, assembly drawings, polarity and special-orientation information
Required quantity, prototype or production stage, and requested delivery schedule
Preferred service model: full turnkey, partial turnkey or consigned/kitted
SMT sides, THT parts, special lead-forming, wave-solder keep-out or pallet requirements
Firmware and programming files, approved fixtures, test procedure, limits and responsibility
Acceptance class when specified, together with inspection, report, traceability and labeling requirements
Packaging, destination and any conformal coating, box-build, cable or other value-added scope
SUNHOPE supports SMT, THT/DIP and mixed-technology assembly. Projects can use full turnkey, partial turnkey or consigned/kitted material models, with additional services reviewed according to the agreed scope.
Choose according to the full component mix and product requirements. SMT is suited to compact, high-density surface-mount designs. THT is often selected for connectors, power parts and mechanically loaded components. Many products require both in a mixed route.
Yes. SUNHOPE's in-house 1–8 layer rigid PCB manufacturing can continue into SMT, THT or mixed assembly within one coordinated project route. The released PCB and assembly revisions still require explicit control.
Yes. Full turnkey can include approved component sourcing, PCB manufacturing and assembly. Partial turnkey and consigned models are also available when purchasing responsibility needs to be divided differently.
No unauthorized substitution is introduced. Manufacturer part numbers, approved alternatives and the authority to accept a change are aligned according to the project before release.
The approved plan may combine 3D SPI, AOI, X-ray, first-article inspection, functional testing and in-circuit testing. Coverage depends on the design, test access, fixtures, firmware, procedures and agreed acceptance requirements.
The published SMT machine capability reaches 0201 metric / 008004 imperial. This is not an unconditional mass-production guarantee; application in production remains subject to DFM review of the complete board, package, stencil, process and inspection plan.
Send the PCB manufacturing data, BOM with manufacturer part numbers, CPL or pick-and-place file, assembly drawings, quantity, delivery expectation and any test or programming files. Identify open decisions instead of hiding them.
A useful quotation should describe not only what will be built, but also how the build will be judged.
Send the PCB data, BOM and assembly information available today. We will review the route, material responsibility, open engineering points and test readiness against the current capability.
